Research output per year
Research output per year
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Dive into the research topics where Takehito Shimatsu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Ag-3at%Cu 薄膜を用いた大気中の原子拡散接合法における接合性能
Translated title of the contribution :Atomic Diffusion Bonding of Wafers in Air Using Ag-3at%Cu Films Research output: Contribution to journal › Article › peer-review
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Atomic Diffusion Bonding of Wafers with PDC-SiO2Underlayers Using Thin Zr Films
Uomoto, M., Shimatsu, T., Goto, T., Hanasaki, T., Bando, K., Suzuki, Y. & Saito, T., 2024, 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024. Institute of Electrical and Electronics Engineers Inc., (2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Atomic Diffusion Bonding Using SiN Films
Muraoka, A., Bando, K., Suzuki, Y., Makita, H., Saito, T., Fukunaga, H., Uomoto, M. & Shimatsu, T., 2024, 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024. Institute of Electrical and Electronics Engineers Inc., (2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films
Iemura, H., Uomoto, M. & Shimatsu, T., 2024, 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024. Institute of Electrical and Electronics Engineers Inc., (2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Bonding Potential of Atomic Diffusion Bonding of Wafers Using Oxide Films
Shimatsu, T., Uomoto, M., Muraoka, A., Bando, K., Suzuki, Y., Makita, H. & Saito, T., 2024, 2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024. Institute of Electrical and Electronics Engineers Inc., (2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
Press/Media
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Researchers at Tohoku University Report New Data on Nanodots (Thermal Activation On Microwave-assisted Magnetization Switching In Co/pt Nanodot Arrays)
23/3/6
1 item of Media coverage
Press/Media
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US Patent Issued to SHINKAWA, TOHOKU UNIVERSITY on Jan. 31 for "Method for producing structure, and structure" (Japanese Inventors)
23/2/1
1 item of Media coverage
Press/Media
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US Patent Issued to TOHOKU UNIVERSITY, CANON ANELVA on Sept. 20 for "Chemical bonding method and joined structure" (Japanese Inventors)
22/9/21
1 item of Media coverage
Press/Media