固相粒子接合界面のナノメカノケミストリー

Translated title of the contribution: Nano-Mechanochemistry at the Solid-State Particle Bonding Interface

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Abstract

Solid-state particle deposition is expected to be a novel material process for producing micrometer-order coatings to centimeter-order thick components by collisional stacking of particles without melting. This research project aims to examine such processes as a series of nano-mechanochemical phenomena, such as the ultrafast deformation of materials occurring in the nanoregion of a solid-state bonding interface. The corresponding chemical changes and the physicochemical phenomena associated with bonding have been analyzed. This research project challenges the practice of extending the mechanics of the materials to explain nano-mechanochemical phenomena that integrate deformation and chemical reactions in micromaterials. In this article, we review the current progress in the solid-state particle deposition process and introduce a direction for this direction.

Translated title of the contributionNano-Mechanochemistry at the Solid-State Particle Bonding Interface
Original languageJapanese
Pages (from-to)678-683
Number of pages6
JournalZairyo/Journal of the Society of Materials Science, Japan
Volume71
Issue number8
DOIs
Publication statusPublished - 2022

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