Fingerprint
Dive into the research topics of '2.5 kV-1000 A Power Pack IGBT (High power flat-packaged RC-IGBT)'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
2.5 kV-1000 A Power Pack IGBT (High power flat-packaged RC-IGBT)
Yoshikazu Takahashi, Koh Yoshikawa, Masayuki Soutome, Takeshi Fujii, Masami Ichijyou, Yasukazu Seki
Research output: Contribution to conference › Paper › peer-review
10
Citations
(Scopus)