3-axis fully-integrated capacitive tactile sensor with flip-bonded CMOS on LTCC interposer

Sho Asano, Masanori Muroyama, Takahiro Nakayama, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

27 Citations (Scopus)


This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au through vias by Au-Au thermo-compression bonding. The CMOS circuit and bonding pads on the sensor backside were electrically connected through Au bumps and the LTCC interposer, and the differential capacitive gap was formed by an Au sealing frame. A diaphragm for sensing 3-axis force was formed in the CMOS substrate. The dimensions of the completed sensor are 2.5 mm in width, 2.5 mm in length, and 0.66 mm in thickness. The fabricated sensor output coded 3-axis capacitive sensing data according to applied 3-axis force by three-dimensional (3D)-printed pins. The measured sensitivity was as high as over 34 Count/mN for normal force and 14 to 15 Count/mN for shear force with small noise, which corresponds to less than 1 mN. The hysteresis and the average cross-sensitivity were also found to be less than 2% full scale and 11%, respectively.

Original languageEnglish
Article number2451
Issue number11
Publication statusPublished - 2017 Nov


  • 3-axis tactile sensor
  • Au-Au thermo-compression bonding
  • Capacitive sensor
  • Low temperature cofired ceramic
  • MEMS-CMOS integration


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