This paper reports a 3-axis MEMS-CMOS integrated tactile sensor for surface-mounting on a flexible bus line. This 3-axis sensor uses a bran-new CMOS LSI with capacitive sensing circuit and other extended functionalities (e.g. configurability and a robust clock data recovery algorithm). The sensor is composed of a flip-bonded CMOS substrate with a sensing diaphragm and a special low temperature co-fired ceramics (LTCC) substrate with vias. These substrates are electrically and mechanically connected by Au-Au bonding, forming sealed differential capacitive gaps. The completed sensor outputs coded 3-axis digital signals according to applied 3-axis force with small cross-sensitivity and hysteresis.
|Title of host publication
|MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
|Institute of Electrical and Electronics Engineers Inc.
|Number of pages
|Published - 2016 Feb 26
|29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China
Duration: 2016 Jan 24 → 2016 Jan 28
|Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
|29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
|16/1/24 → 16/1/28