3D hybrid integration technology for opto-electronic hetero-integrated systems

We developed a 3D hybrid integration technology of complementary metal oxide semiconductor (CMOS), micro electro mechanical systems (MEMS) and photonic circuits for opto-electronic hetero-integrated systems. The 3D opto-electronic multi-chip module comprising CMOS, MEMS, and photonic devices was fabricated by using 3D hybrid integration technology. The electrical chips of amplitude shift keying (ASK) LSI, LC filter and pressure-sensing MEMS were mounted on the electrical Si interposer with Cu through silicon vias (TSVs). The photonic chips of vertical-cavity surface-emitting laser (VCSEL) and photodiode (PD) were embedded into the optical Si interposer with an optical waveguide. The electrical and the optical interposers were precisely bonded together to form 3D opto-electronic multi-chip module. The photonics and electrical devices are communicated via Cu TSVs. The photonic devices were connected via an optical waveguide. Basic functions of CMOS, MEMS and photonic devices in the 3D opto-electronic multi-chip module were successfully evaluated.