3D integration technology for 3D stacked retinal chip

Y. Kaiho; Y. Ohara; H. Takeshita; K. Kiyoyama; K. W. Lee; T. Tanaka; M. Koyanagi

doi:10.1109/3DIC.2009.5306564

3D integration technology for 3D stacked retinal chip

Y. Kaiho, Y. Ohara, H. Takeshita, K. Kiyoyama, K. W. Lee, T. Tanaka, M. Koyanagi

MEN - Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Citations (Scopus)

Abstract

To recover visual sensation of blind patients, we have proposed a novel three dimensionally (3D) stacked retinal prosthesis chip in which several LSI chips such as consisting of photodetector, signal processing circuit and stimulus current generator are vertically stacked and electrically connected using 3D integration technology. In this work, we developed several key process for realizing 3D stacked retinal prosthesis chip. Fine sized Cu TSV of 10 μm width and 30 μm depth was successfully formed from the back side of the thinned prosthesis chip. The prosthesis chip with the back side Cu TSVs was flip-chip bonded to Si substrate/flexible substrate through Cu/Sn micro-bumps for evaluating the feasibility of 3D integration technology.

Original language	English
Title of host publication	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs	https://doi.org/10.1109/3DIC.2009.5306564
Publication status	Published - 2009
Event	2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States Duration: 2009 Sept 28 → 2009 Sept 30

Publication series

Name	2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Country/Territory	United States
City	San Francisco, CA
Period	09/9/28 → 09/9/30

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/3DIC.2009.5306564

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Kaiho, Y, Ohara, Y, Takeshita, H, Kiyoyama, K, Lee, KW, Tanaka, T & Koyanagi, M 2009, 3D integration technology for 3D stacked retinal chip. in 2009 IEEE International Conference on 3D System Integration, 3DIC 2009., 5306564, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, CA, United States, 09/9/28. https://doi.org/10.1109/3DIC.2009.5306564

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title = "3D integration technology for 3D stacked retinal chip",

abstract = "To recover visual sensation of blind patients, we have proposed a novel three dimensionally (3D) stacked retinal prosthesis chip in which several LSI chips such as consisting of photodetector, signal processing circuit and stimulus current generator are vertically stacked and electrically connected using 3D integration technology. In this work, we developed several key process for realizing 3D stacked retinal prosthesis chip. Fine sized Cu TSV of 10 μm width and 30 μm depth was successfully formed from the back side of the thinned prosthesis chip. The prosthesis chip with the back side Cu TSVs was flip-chip bonded to Si substrate/flexible substrate through Cu/Sn micro-bumps for evaluating the feasibility of 3D integration technology.",

author = "Y. Kaiho and Y. Ohara and H. Takeshita and K. Kiyoyama and Lee, {K. W.} and T. Tanaka and M. Koyanagi",

year = "2009",

doi = "10.1109/3DIC.2009.5306564",

language = "English",

isbn = "9781424445127",

series = "2009 IEEE International Conference on 3D System Integration, 3DIC 2009",

booktitle = "2009 IEEE International Conference on 3D System Integration, 3DIC 2009",

note = "2009 IEEE International Conference on 3D System Integration, 3DIC 2009 ; Conference date: 28-09-2009 Through 30-09-2009",

}

TY - GEN

T1 - 3D integration technology for 3D stacked retinal chip

AU - Kaiho, Y.

AU - Ohara, Y.

AU - Takeshita, H.

AU - Kiyoyama, K.

AU - Lee, K. W.

AU - Tanaka, T.

AU - Koyanagi, M.

PY - 2009

Y1 - 2009

N2 - To recover visual sensation of blind patients, we have proposed a novel three dimensionally (3D) stacked retinal prosthesis chip in which several LSI chips such as consisting of photodetector, signal processing circuit and stimulus current generator are vertically stacked and electrically connected using 3D integration technology. In this work, we developed several key process for realizing 3D stacked retinal prosthesis chip. Fine sized Cu TSV of 10 μm width and 30 μm depth was successfully formed from the back side of the thinned prosthesis chip. The prosthesis chip with the back side Cu TSVs was flip-chip bonded to Si substrate/flexible substrate through Cu/Sn micro-bumps for evaluating the feasibility of 3D integration technology.

AB - To recover visual sensation of blind patients, we have proposed a novel three dimensionally (3D) stacked retinal prosthesis chip in which several LSI chips such as consisting of photodetector, signal processing circuit and stimulus current generator are vertically stacked and electrically connected using 3D integration technology. In this work, we developed several key process for realizing 3D stacked retinal prosthesis chip. Fine sized Cu TSV of 10 μm width and 30 μm depth was successfully formed from the back side of the thinned prosthesis chip. The prosthesis chip with the back side Cu TSVs was flip-chip bonded to Si substrate/flexible substrate through Cu/Sn micro-bumps for evaluating the feasibility of 3D integration technology.

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U2 - 10.1109/3DIC.2009.5306564

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M3 - Conference contribution

AN - SCOPUS:70549098729

SN - 9781424445127

T3 - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009

BT - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009

T2 - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Y2 - 28 September 2009 through 30 September 2009

ER -

3D integration technology for 3D stacked retinal chip

Abstract

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