Abstract
We carried out calculations to investigate the influence of thermal conductivity of the wall of a crucible on thermal stress and dislocations in a silicon ingot during a solidification process using a three-dimensional global analysis. It was found that the mc interface shape and the temperature gradient in a silicon ingot have significant influence on thermal stress and dislocations due to different thermal conductivity of the wall of a crucible. Therefore, we should control not only the mc interface shape, but also temperature gradient in a silicon ingot in order to reduce thermal stress and dislocations in a silicon ingot during a solidification process.
Original language | English |
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Pages (from-to) | 259-264 |
Number of pages | 6 |
Journal | Journal of Crystal Growth |
Volume | 318 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2011 Mar 1 |
Externally published | Yes |
Keywords
- A1. Computer simulation
- A1. Defects
- A1. Solidification
- A1. Stresses
ASJC Scopus subject areas
- Condensed Matter Physics
- Inorganic Chemistry
- Materials Chemistry