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3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
12
Citations
(Scopus)