3D system integration technology and 3D systems

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Citations (Scopus)


We introduce 3D integration technologies using wafer-on-wafer bonding and chip-on-wafer bonding methods. The latter chip-to-wafer 3D integration based on a self-assembly process is called "super chip integration". In the super chip integration technology, a large number of LSI chips can be simultaneously, quickly, and precisely aligned and bonded onto LSI wafers. By using the key technologies including TSV (through-Si via) formation and self-assembly, we successfully fabricated prototype 3D LSI chips.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2008, AMC 2008
Number of pages7
Publication statusPublished - 2009
EventAdvanced Metallization Conference 2008, AMC 2008 - San Diego, CA, United States
Duration: 2008 Sept 232008 Sept 25

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766


ConferenceAdvanced Metallization Conference 2008, AMC 2008
Country/TerritoryUnited States
CitySan Diego, CA


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