TY - GEN
T1 - 3D system integration technology and 3D systems
AU - Fukushima, Takafumi
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
PY - 2009
Y1 - 2009
N2 - We introduce 3D integration technologies using wafer-on-wafer bonding and chip-on-wafer bonding methods. The latter chip-to-wafer 3D integration based on a self-assembly process is called "super chip integration". In the super chip integration technology, a large number of LSI chips can be simultaneously, quickly, and precisely aligned and bonded onto LSI wafers. By using the key technologies including TSV (through-Si via) formation and self-assembly, we successfully fabricated prototype 3D LSI chips.
AB - We introduce 3D integration technologies using wafer-on-wafer bonding and chip-on-wafer bonding methods. The latter chip-to-wafer 3D integration based on a self-assembly process is called "super chip integration". In the super chip integration technology, a large number of LSI chips can be simultaneously, quickly, and precisely aligned and bonded onto LSI wafers. By using the key technologies including TSV (through-Si via) formation and self-assembly, we successfully fabricated prototype 3D LSI chips.
UR - http://www.scopus.com/inward/record.url?scp=70349952024&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70349952024&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:70349952024
SN - 9781605111254
T3 - Advanced Metallization Conference (AMC)
SP - 479
EP - 485
BT - Advanced Metallization Conference 2008, AMC 2008
T2 - Advanced Metallization Conference 2008, AMC 2008
Y2 - 23 September 2008 through 25 September 2008
ER -