TY - GEN
T1 - 40-Gb/s IC and packaging technologies for future lightwave communications
AU - Imai, Yuhki
AU - Otsuji, Taiichi
AU - Sano, Eiichi
AU - Umeda, Yohtaro
PY - 1997
Y1 - 1997
N2 - This paper reviews recent advances made at our laboratories in device, circuit-design, and module-design technologies for future very-high-speed lightwave communications. ICs and modules developed using 0.1 micrometer gate-length InAlAs/InGaAs HEMTs demonstrate promising performance suited to 40-Gb/s applications.
AB - This paper reviews recent advances made at our laboratories in device, circuit-design, and module-design technologies for future very-high-speed lightwave communications. ICs and modules developed using 0.1 micrometer gate-length InAlAs/InGaAs HEMTs demonstrate promising performance suited to 40-Gb/s applications.
UR - http://www.scopus.com/inward/record.url?scp=0031364555&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0031364555&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0031364555
SN - 0819424498
T3 - Proceedings of SPIE - The International Society for Optical Engineering
SP - 186
EP - 197
BT - Proceedings of SPIE - The International Society for Optical Engineering
PB - Society of Photo-Optical Instrumentation Engineers
T2 - High-Speed Semiconductor Lasers for Communication
Y2 - 10 February 1997 through 11 February 1997
ER -