TY - GEN
T1 - 60-GHz-band transmission module for 3-dimensional system-in-package
AU - Masuda, Kohei
AU - Takeuchi, Futoshi
AU - Hamada, Yasuhiro
AU - Maruhashi, Kenichi
AU - Oguma, Hiroshi
AU - Kameda, Suguru
AU - Nakase, Hiroyuki
AU - Takagi, Tadashi
AU - Tsubouchi, Kazuo
PY - 2006
Y1 - 2006
N2 - We have proposed an ultra-small and low-cost wireless 3-dimentional system-in-package that includes 60-GHz-band radio frequency (RF) components. 60-GHz-band integrated circuits (ICs) of a 60-GHz-band transmission (TX) module were mounted onto an Any Laya Interstitial Via Hole (ALIVH) substrate using stud bump bonding (SBB) technology. A mixer using antiparallel diode pair, power amplifier and driver amplifier ICs were fabricated on GaAs substrates. The characteristics of the fabricated TX module in a package were measured. The measured convasion gain and output power at 1-dB gain compression point of the TX module using a single balance mixer were 13 dB and 12 dBm, respectively. The 3-dB bandwidth at lowa-side-band (LSB) output was found to be 3 GHz. The measured conversion gain and output power at 1-dB gain compression point of the TX module using a double balance mixer were 11 dB and 10.5 dBm, respectively. The 3-dB bandwidth at LSB output was found to be 3.6 GHz. The measurement results showed sufficient paformance for a 60-GHz-band TX module.
AB - We have proposed an ultra-small and low-cost wireless 3-dimentional system-in-package that includes 60-GHz-band radio frequency (RF) components. 60-GHz-band integrated circuits (ICs) of a 60-GHz-band transmission (TX) module were mounted onto an Any Laya Interstitial Via Hole (ALIVH) substrate using stud bump bonding (SBB) technology. A mixer using antiparallel diode pair, power amplifier and driver amplifier ICs were fabricated on GaAs substrates. The characteristics of the fabricated TX module in a package were measured. The measured convasion gain and output power at 1-dB gain compression point of the TX module using a single balance mixer were 13 dB and 12 dBm, respectively. The 3-dB bandwidth at lowa-side-band (LSB) output was found to be 3 GHz. The measured conversion gain and output power at 1-dB gain compression point of the TX module using a double balance mixer were 11 dB and 10.5 dBm, respectively. The 3-dB bandwidth at LSB output was found to be 3.6 GHz. The measurement results showed sufficient paformance for a 60-GHz-band TX module.
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U2 - 10.1109/EPTC.2006.342697
DO - 10.1109/EPTC.2006.342697
M3 - Conference contribution
AN - SCOPUS:50249117276
SN - 142440665X
SN - 9781424406654
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 90
EP - 95
BT - 2006 8th Electronics Packaging Technology Conference, EPTC
T2 - 2006 8th Electronics Packaging Technology Conference, EPTC
Y2 - 6 December 2006 through 8 December 2006
ER -