A low cost, small size antenna integrated transceiver module is one of the key technologies for the diffusion of short range millimeter-wave wireless communication. In this paper, 60GHz antenna integrated module technology is introduced, which based on 3-D system in package (SiP) technology. This module has a multi-level stacked organic substrates configuration. The use of low cost / low dielectric constant organic multi-layer substrates, stud bump bonding (SBB) for RFIC/MMIC flip-chip mounting and Cu ball interconnection for multi-level organic substrate stacking enable to realize low production cost and small size transceiver modules. Thank to the lower dielectric constant of organic substrate than that of conventional ceramic substrate, integration of antenna into the RF module becomes easy. The realization of phased array anttena module using same structure is also described.