TY - GEN
T1 - 60GHz antenna integrated transmitter module
AU - Suematsu, Noriharu
AU - Tanifuji, Shoichi
AU - Yoshida, Satoshi
AU - Suzuki, Yuya
AU - Kameda, Suguru
AU - Takagi, Tadashi
AU - Tsubouchi, Kazuo
PY - 2012
Y1 - 2012
N2 - A low cost, small size antenna integrated transceiver module is one of the key technologies for the diffusion of short range millimeter-wave wireless communication. In this paper, 60GHz antenna integrated module technology is introduced, which based on 3-D system in package (SiP) technology. This module has a multi-level stacked organic substrates configuration. The use of low cost / low dielectric constant organic multi-layer substrates, stud bump bonding (SBB) for RFIC/MMIC flip-chip mounting and Cu ball interconnection for multi-level organic substrate stacking enable to realize low production cost and small size transceiver modules. Thank to the lower dielectric constant of organic substrate than that of conventional ceramic substrate, integration of antenna into the RF module becomes easy. The realization of phased array anttena module using same structure is also described.
AB - A low cost, small size antenna integrated transceiver module is one of the key technologies for the diffusion of short range millimeter-wave wireless communication. In this paper, 60GHz antenna integrated module technology is introduced, which based on 3-D system in package (SiP) technology. This module has a multi-level stacked organic substrates configuration. The use of low cost / low dielectric constant organic multi-layer substrates, stud bump bonding (SBB) for RFIC/MMIC flip-chip mounting and Cu ball interconnection for multi-level organic substrate stacking enable to realize low production cost and small size transceiver modules. Thank to the lower dielectric constant of organic substrate than that of conventional ceramic substrate, integration of antenna into the RF module becomes easy. The realization of phased array anttena module using same structure is also described.
UR - http://www.scopus.com/inward/record.url?scp=84879762373&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84879762373&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2012.6523437
DO - 10.1109/ICSJ.2012.6523437
M3 - Conference contribution
AN - SCOPUS:84879762373
SN - 9781467326551
T3 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
BT - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
T2 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Y2 - 10 December 2012 through 12 December 2012
ER -