@inproceedings{d27a037e74a5465982a34e2042e261c9,
title = "60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates",
abstract = "A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.",
keywords = "Antenna Integration, Millimeter-wave, MMIC, Module, RFIC, SiP, Stud bump",
author = "Noriharu Suematsu and Satoshi Yoshida and Shoichi Tanifuji and Suguru Kameda and Tadashi Takagi and Kazuo Tsubouchi",
year = "2011",
language = "English",
isbn = "9782874870224",
series = "European Microwave Week 2011: {"}Wave to the Future{"}, EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011",
pages = "551--554",
booktitle = "European Microwave Week 2011",
note = "14th European Microwave Week 2011: {"}Wave to the Future{"}, EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011 ; Conference date: 10-10-2011 Through 13-10-2011",
}