TY - GEN
T1 - A 1.7mm3 MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication
AU - Makihata, M.
AU - Muroyama, M.
AU - Nakano, Y.
AU - Tanaka, S.
AU - Nakayama, T.
AU - Yamaguchi, U.
AU - Yamada, H.
AU - Nonomura, Y.
AU - Funabashi, H.
AU - Hata, Y.
AU - Esashi, M.
PY - 2013
Y1 - 2013
N2 - A bus-connected tactile sensor system composed of MEMS-CMOS integrated force sensors was developed. A capacitance-to-digital convertor for force sensing, a data reduction processor and a serial bus communication controller are implemented by a laboratory-designed ASIC (Application Specific Integrated Circuit). These functions enable the tactile sensor to be connected with a serial bus cable, and to autonomously transmit sensing data using CSMA (Carrier Sense Multiple Access) protocol. By applying a novel MEMS-CMOS integration technology, the integrated tactile sensor can be directly mounted on a flexible printed circuit board. The chip size is 2.54mm × 2.54mm × 0.27mm, i.e. 1.7mm3, and there are 20 through-silicon interconnection using saw-diced lateral tapered grooves. The digital data from the completed tactile sensor contains 32 bit force sensing data, which corresponds to an external force linearly. Data reduction processing based on threshold operation and adaptation inspired by tactile receptors was carried out to overcome packet collision problem. Finally, the serial bus network was demonstrated using three sensors to evaluate the network performance.
AB - A bus-connected tactile sensor system composed of MEMS-CMOS integrated force sensors was developed. A capacitance-to-digital convertor for force sensing, a data reduction processor and a serial bus communication controller are implemented by a laboratory-designed ASIC (Application Specific Integrated Circuit). These functions enable the tactile sensor to be connected with a serial bus cable, and to autonomously transmit sensing data using CSMA (Carrier Sense Multiple Access) protocol. By applying a novel MEMS-CMOS integration technology, the integrated tactile sensor can be directly mounted on a flexible printed circuit board. The chip size is 2.54mm × 2.54mm × 0.27mm, i.e. 1.7mm3, and there are 20 through-silicon interconnection using saw-diced lateral tapered grooves. The digital data from the completed tactile sensor contains 32 bit force sensing data, which corresponds to an external force linearly. Data reduction processing based on threshold operation and adaptation inspired by tactile receptors was carried out to overcome packet collision problem. Finally, the serial bus network was demonstrated using three sensors to evaluate the network performance.
KW - MEMS-CMOS integration
KW - sensor network
KW - Tactile sensor
KW - wafer level packaging
UR - http://www.scopus.com/inward/record.url?scp=84891666970&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84891666970&partnerID=8YFLogxK
U2 - 10.1109/Transducers.2013.6627370
DO - 10.1109/Transducers.2013.6627370
M3 - Conference contribution
AN - SCOPUS:84891666970
SN - 9781467359818
T3 - 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
SP - 2729
EP - 2732
BT - 2013 Transducers and Eurosensors XXVII
T2 - 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Y2 - 16 June 2013 through 20 June 2013
ER -