Abstract
This article presents a prototype 22.4~mu text{m} pixel pitch global shutter (GS) wide dynamic range (WDR) soft X-ray CMOS image sensor (sxCMOS). Backside-illuminated (BSI) pinned photodiodes with a 45-mu text{m} thick Si substrate were introduced for low noise and high radiation hardness to high energy photons. Two-stage lateral overflow integration capacitor (LOFIC) and voltage domain memory bank with high-density Si trench capacitors were introduced for WDR and for GS. The developed sxCMOS achieved maximum 21.9 Me- full well capacity with a single exposure 129 dB dynamic range by GS operation. Over 70% quantum efficiency (QE) toward soft X-ray was successfully achieved. The developed prototype sxCMOS is a step forward toward a 4 M pixel detector system to be utilized in next-generation synchrotron radiation facilities and X-ray free-electron lasers.
Original language | English |
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Article number | 9378940 |
Pages (from-to) | 2056-2063 |
Number of pages | 8 |
Journal | IEEE Transactions on Electron Devices |
Volume | 68 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2021 Apr |
Keywords
- Backside-illuminated (BSI)
- CMOS image sensor (CIS)
- coherent X-ray diffraction imaging (CDI)
- global shutter (GS)
- lateral overflow integration capacitor (LOFIC)
- soft X-ray
- wide dynamic range (WDR)
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering