TY - GEN
T1 - A hierarchic bonding procedure for the assembly of micro confocal microscope
AU - Jia, C.
AU - Frömel, J.
AU - Wiemer, M.
AU - Gessner, T.
AU - Bargiel, S.
AU - Passilly, N.
AU - Barański, M.
AU - Gorecki, C.
PY - 2012
Y1 - 2012
N2 - The construction of optical micro systems imposes new challenges on assembly technologies. These include the handling of multiple heterogeneous substrates, low thermal budget for the establishment of bonding connections, the accurate alignment of the substrates during wafer stacking and the integration of special components such as discrete optical lenses. In order to address these problems, a hierarchic wafer/component bonding process is proposed for the assembly of a 3-axis confocal scanning microscope. Experiment results indicate that the 9 constitutive components of the microscope, which are made from materials with different thermal expansion coefficients, can be joined together at less than 400°C global temperature. The strength of the achieved bonding is comparable to standard anodic or fusion bonding and can withstand diverse back-end-of-line processes such as dicing or grinding. Besides, the hermeticity of the developed bonding process is validated by monitoring the static deformation of a leak-indicating membrane.
AB - The construction of optical micro systems imposes new challenges on assembly technologies. These include the handling of multiple heterogeneous substrates, low thermal budget for the establishment of bonding connections, the accurate alignment of the substrates during wafer stacking and the integration of special components such as discrete optical lenses. In order to address these problems, a hierarchic wafer/component bonding process is proposed for the assembly of a 3-axis confocal scanning microscope. Experiment results indicate that the 9 constitutive components of the microscope, which are made from materials with different thermal expansion coefficients, can be joined together at less than 400°C global temperature. The strength of the achieved bonding is comparable to standard anodic or fusion bonding and can withstand diverse back-end-of-line processes such as dicing or grinding. Besides, the hermeticity of the developed bonding process is validated by monitoring the static deformation of a leak-indicating membrane.
KW - MOEMS
KW - confocal microscope
KW - heterogeneous system integration
KW - microsystem technology
KW - wafer bonding
UR - http://www.scopus.com/inward/record.url?scp=84864864469&partnerID=8YFLogxK
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U2 - 10.1109/LTB-3D.2012.6238087
DO - 10.1109/LTB-3D.2012.6238087
M3 - Conference contribution
AN - SCOPUS:84864864469
SN - 9781467307420
T3 - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
SP - 187
EP - 189
BT - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
T2 - 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Y2 - 22 May 2012 through 23 May 2012
ER -