TY - JOUR
T1 - A High Near-Infrared Sensitivity over 70-dB SNR CMOS Image Sensor with Lateral Overflow Integration Trench Capacitor
AU - Murata, Maasa
AU - Kuroda, Rihito
AU - Fujihara, Yasuyuki
AU - Otsuka, Yusuke
AU - Shibata, Hiroshi
AU - Shibaguchi, Taku
AU - Kamata, Yutaka
AU - Miura, Noriyuki
AU - Kuriyama, Naoya
AU - Sugawa, Shigetoshi
N1 - Funding Information:
Manuscript received November 7, 2019; revised January 17, 2020 and February 6, 2020; accepted February 15, 2020. Date of publication March 10, 2020; date of current version March 24, 2020. This work was supported in part by the Japan Society for the Promotion of Science (JSPS) the Grant-in-Aid for Scientific Research (KAKENHI) under Grant 17H04921 and Grant 18J20657. The review of this article was arranged by Editor L. Pancheri. (Corresponding author: Rihito Kuroda.) Maasa Murata, Rihito Kuroda, Yasuyuki Fujihara, Yusuke Otsuka, and Shigetoshi Sugawa are with the Graduate School of Engineering, Tohoku University, Sendai 980-8577, Japan (e-mail: maasa. murata.t5@dc.tohoku.ac.jp; rihito.kuroda.e3@tohoku.ac.jp).
Publisher Copyright:
© 1963-2012 IEEE.
PY - 2020/4/1
Y1 - 2020/4/1
N2 - This article presents a 16- \mu \text{m} pitch CMOS image sensor (CIS) exhibiting a high near-infrared (NIR) sensitivity and a 71.3-dB signal-to-noise ratio (SNR) with a linear response for high-precision absorption imaging. A 1.6-pF lateral overflow integration trench capacitor (LOFITreC) was introduced in each pixel to achieve a very high full well capacity (FWC), and a very low impurity concentration p-type Cz-Si substrate with a low oxygen concentration was employed for improving the NIR sensitivity. The developed CIS operated at a single exposure linear response wide dynamic range (DR) mode and a dual reset voltage mode for high SNR absorption imaging and achieved the maximum 24.3 Me- FWC, a wide spectral sensitivity from 200 to 1100 nm, and a photodiode quantum efficiency of 89.7%, 78.2%, and 26.7% at 860, 940, and 1050 nm, respectively. Both the spatial resolution and light sensitivity toward the NIR light were further improved by thinning the Si substrate and by applying a negative backside bias. Due to the LOFITreC, a record spatial efficiency of 95 ke ^{-}/\mu \text{m}^{{2}} with a 130-dB DR was achieved. As one of the applications of the developed CIS, the NIR absorption imaging toward a noninvasive blood glucose measurement was experimented and a diffusion of 5 mg/dl glucose was clearly visualized at 1050 nm in real time.
AB - This article presents a 16- \mu \text{m} pitch CMOS image sensor (CIS) exhibiting a high near-infrared (NIR) sensitivity and a 71.3-dB signal-to-noise ratio (SNR) with a linear response for high-precision absorption imaging. A 1.6-pF lateral overflow integration trench capacitor (LOFITreC) was introduced in each pixel to achieve a very high full well capacity (FWC), and a very low impurity concentration p-type Cz-Si substrate with a low oxygen concentration was employed for improving the NIR sensitivity. The developed CIS operated at a single exposure linear response wide dynamic range (DR) mode and a dual reset voltage mode for high SNR absorption imaging and achieved the maximum 24.3 Me- FWC, a wide spectral sensitivity from 200 to 1100 nm, and a photodiode quantum efficiency of 89.7%, 78.2%, and 26.7% at 860, 940, and 1050 nm, respectively. Both the spatial resolution and light sensitivity toward the NIR light were further improved by thinning the Si substrate and by applying a negative backside bias. Due to the LOFITreC, a record spatial efficiency of 95 ke ^{-}/\mu \text{m}^{{2}} with a 130-dB DR was achieved. As one of the applications of the developed CIS, the NIR absorption imaging toward a noninvasive blood glucose measurement was experimented and a diffusion of 5 mg/dl glucose was clearly visualized at 1050 nm in real time.
KW - Absorption imaging
KW - CMOS image sensor (CIS)
KW - Lateral overflow integration trench capacitor (LOFITreC)
KW - Near-infrared (NIR) light
KW - Signal-to-noise ratio (SNR)
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U2 - 10.1109/TED.2020.2975602
DO - 10.1109/TED.2020.2975602
M3 - Article
AN - SCOPUS:85082851320
SN - 0018-9383
VL - 67
SP - 1653
EP - 1659
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 4
M1 - 9031733
ER -