A matched expansion MEMS probe card with low CTE LTCC substrate

Seong Hun Choe, Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)


This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/°C The probes are first formed on a silicon wafer, and then transferred to the LTCC substrate using Au/Sn solder bumps. The prototyped probe card was preliminarily evaluated in contact resistance. The measured contact resistance was 0.14 Q during 2500 touchdowns.

Original languageEnglish
Title of host publication2007 IEEE International Test Conference, ITC
Publication statusPublished - 2008
Event2007 IEEE International Test Conference, ITC - Santa Clara, CA, United States
Duration: 2007 Oct 232007 Oct 25

Publication series

NameProceedings - International Test Conference
ISSN (Print)1089-3539


Conference2007 IEEE International Test Conference, ITC
Country/TerritoryUnited States
CitySanta Clara, CA


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