TY - GEN
T1 - A matched expansion MEMS probe card with low CTE LTCC substrate
AU - Choe, Seong Hun
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2008
Y1 - 2008
N2 - This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/°C The probes are first formed on a silicon wafer, and then transferred to the LTCC substrate using Au/Sn solder bumps. The prototyped probe card was preliminarily evaluated in contact resistance. The measured contact resistance was 0.14 Q during 2500 touchdowns.
AB - This paper describes the fabrication technology of a new MEMS-based probe card. The probe card is designed to satisfy requirements from advanced wafer-level burn-in LSI tests. The problem of thermal expansion mismatch between the probe card and LSI wafers is solved by using a LTCC (low temperature cofired ceramics) substrate with a coefficient of thermal expansion of 3.4 ppm/°C The probes are first formed on a silicon wafer, and then transferred to the LTCC substrate using Au/Sn solder bumps. The prototyped probe card was preliminarily evaluated in contact resistance. The measured contact resistance was 0.14 Q during 2500 touchdowns.
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U2 - 10.1109/TEST.2007.4437618
DO - 10.1109/TEST.2007.4437618
M3 - Conference contribution
AN - SCOPUS:39749152301
SN - 1424411289
SN - 9781424411283
T3 - Proceedings - International Test Conference
BT - 2007 IEEE International Test Conference, ITC
T2 - 2007 IEEE International Test Conference, ITC
Y2 - 23 October 2007 through 25 October 2007
ER -