@inproceedings{2a9ba2835a6f428589407f7e8ad7f2d9,
title = "A matched expansion probe card for high temperature LSI testing",
abstract = "This paper describes the fabrication process and mechanical prosperities of a novel probe card were described. To match the thermal expansion between the probe card and a silicon wafer in wafer-level burn-in test, a Pyrex glass substrate with feedthrough connections was used to support the probes. To make the slantwise probe contactors, spray coating was used to form a uniform photoresist film on a deeply-wet-etched silicon wafer. The fabricated probe card has 13185 p+ silicon probe contactors at a pitch of 150 μm on a area of 44.0 mm × 45.7 mm. The rigidity of the probes is approximately 91.45 N/m. The planarity of the probe tips is within ±1 μm from the base level.",
keywords = "Probe card, Spray coating, Thermal expansion",
author = "Choe, {Seong Hun} and Satoshi Fujimoto and Shuji Tanaka and Masayoshi Esashi",
year = "2005",
language = "English",
isbn = "0780389948",
series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",
pages = "1259--1262",
booktitle = "TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers",
note = "13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 ; Conference date: 05-06-2005 Through 09-06-2005",
}