@inproceedings{365a09699567404c92a5177602287b0e,
title = "A new temporary bonding technology with spin-on glass and hydrogenated amorphous Si for 3D LSIs",
abstract = "A new temporary bonding technology has been demonstrated, where both spin-on glass (SOG) and hydrogenated amorphous silicon (a-Si:H) were used as a bonding layer and as a debonding layer, respectively. Square chips were bonded to a glass wafer through the SOG layer and a-Si:H layer. The SOG bonding was capable of withstanding chip thinning and high-temperature chemical vapor deposition (CVD) processes. A XeCl excimer laser was irradiated to the a-Si:H layer through the glass wafers for debonding the chips. A novel via-last/backside-via 3D integration process using temporary SOG bonding was also proposed for advanced multichip-to-wafer 3D integration with self-assembly.",
keywords = "3D integration, Chip on wafer, Temporary bonding/de-bonding",
author = "H. Hashiguchi and T. Fukushima and H. Kino and Lee, {K. W.} and T. Tanaka and M. Koyanagi",
year = "2014",
month = jan,
day = "1",
doi = "10.1109/ICEP.2014.6826664",
language = "English",
isbn = "9784904090107",
series = "2014 International Conference on Electronics Packaging, ICEP 2014",
publisher = "IEEE Computer Society",
pages = "74--77",
booktitle = "2014 International Conference on Electronics Packaging, ICEP 2014",
note = "2014 International Conference on Electronics Packaging, ICEP 2014 ; Conference date: 23-04-2014 Through 25-04-2014",
}