A numerical simulation of nanostructure formation utilizing electromigration

Kazuhiko Sasagawa, Shota Fukushi, Yuxin Sun, Masumi Saka

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


A numerical method to simulate nanostructure formation due to electromigration in passivated Al specimens is developed based on the governing parameter for electromigration damage, AFD* gen. The nanostructure formation is influenced by conditions such as the current density and substrate temperature. The results of the simulations are verified through experiments, and good agreement between the simulations and experiments is found for changes in nanostructure volume. The simulation is expected to be useful for identifying effective conditions for nanostructure formation.

Original languageEnglish
Pages (from-to)2201-2206
Number of pages6
JournalJournal of Electronic Materials
Issue number10
Publication statusPublished - 2009 Oct


  • Aluminum
  • Electromigration
  • Grain boundary diffusion
  • Nanostructure
  • Simulation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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