In this study, we successfully fabricated positive photosensitive epoxy resins based on the Reaction Development Patterning (RDP) by using B-staged polymers prepared by polyaddition between an epoxy base resin and an acid anhydride curing agent during mixing and prebaking processes. Application of RDP to the B-staged polymers afforded positive fine patterns by the use of 15-mol% sodium 2-aminoethoxide in ethanolamine/NMP mixtures. Furthermore, the fine epoxy patterns were not deformed after heat treatment for complete curing, indicating that the cress-linked epoxy patterns have high tolerability to thermal stresses. These results suggest the possibility of practical application of RDP-based positive photosensitive epoxy resins.
- Photosensitive epoxy resin
- Positive patterns
- Reaction development patterning