This paper describes low-temperature metal thermo-compression bonding technology using fly-cut planarized electroplated metal bonding frames for wafer-level integration of heterogeneous elements such as MEMS and CMOS-LSI. The process has a significant advantage over the other established integration processes in vacuum packaging for non-planer (i.e. stepped or micro-structured) wafers and temperature-sensitive fragile wafers. A cost-effective MEMS-LSI integration platform utilizing the developed wafer-level bonding technology for the integration of various MEMS elements with a commercial multi-project CMOS wafer has been also developed. The platform is suitable for the prototyping or small-scale production of future heterogeneously integrated devices such as intelligent and autonomy sensors.