Acoustic emission sensors using silicon mechanical resonators

Kengo Takata; Takashi Sasaki; Mitsutomo Nishizawa; Hiroshi Saito; Shinsuke Yamazaki; Daisuke Matsuura; Kazuhiro Hane

doi:10.1541/ieejsmas.135.484

Acoustic emission sensors using silicon mechanical resonators

Kengo Takata, Takashi Sasaki, Mitsutomo Nishizawa, Hiroshi Saito, Shinsuke Yamazaki, Daisuke Matsuura, Kazuhiro Hane

New Industry Creation Hatchery Center (NICHe)

Research output: Contribution to journal › Article › peer-review

Abstract

Ultrasonic sensors using cantilever beam and free-free beam resonators are designed and fabricated for acoustic emission (AE) sensing. The sensors are operated under the resonant conditions and the generated oscillation is detected by silicon piezoresistors. In order to investigate the air friction of the resonators, the quality factors are measured as a function of pressure. The sensitivities of the two resonators are compared. The cantilever beam resonator is vacuum-packaged by glass-silicon anodic bonding and the AE sensing test is carried out by the method of breaking pencil lead. The response time of the vacuum packaged sensor is also measured.

Original language	English
Pages (from-to)	484-489
Number of pages	6
Journal	IEEJ Transactions on Sensors and Micromachines
Volume	135
Issue number	12
DOIs	https://doi.org/10.1541/ieejsmas.135.484
Publication status	Published - 2015 Dec 1

Keywords

Acoustic emission sensor
Piezoresistor
Q factor
Silicon resonator
Vacuum package

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10.1541/ieejsmas.135.484

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title = "Acoustic emission sensors using silicon mechanical resonators",

abstract = "Ultrasonic sensors using cantilever beam and free-free beam resonators are designed and fabricated for acoustic emission (AE) sensing. The sensors are operated under the resonant conditions and the generated oscillation is detected by silicon piezoresistors. In order to investigate the air friction of the resonators, the quality factors are measured as a function of pressure. The sensitivities of the two resonators are compared. The cantilever beam resonator is vacuum-packaged by glass-silicon anodic bonding and the AE sensing test is carried out by the method of breaking pencil lead. The response time of the vacuum packaged sensor is also measured.",

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AU - Takata, Kengo

AU - Sasaki, Takashi

AU - Nishizawa, Mitsutomo

AU - Saito, Hiroshi

AU - Yamazaki, Shinsuke

AU - Matsuura, Daisuke

AU - Hane, Kazuhiro

PY - 2015/12/1

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N2 - Ultrasonic sensors using cantilever beam and free-free beam resonators are designed and fabricated for acoustic emission (AE) sensing. The sensors are operated under the resonant conditions and the generated oscillation is detected by silicon piezoresistors. In order to investigate the air friction of the resonators, the quality factors are measured as a function of pressure. The sensitivities of the two resonators are compared. The cantilever beam resonator is vacuum-packaged by glass-silicon anodic bonding and the AE sensing test is carried out by the method of breaking pencil lead. The response time of the vacuum packaged sensor is also measured.

AB - Ultrasonic sensors using cantilever beam and free-free beam resonators are designed and fabricated for acoustic emission (AE) sensing. The sensors are operated under the resonant conditions and the generated oscillation is detected by silicon piezoresistors. In order to investigate the air friction of the resonators, the quality factors are measured as a function of pressure. The sensitivities of the two resonators are compared. The cantilever beam resonator is vacuum-packaged by glass-silicon anodic bonding and the AE sensing test is carried out by the method of breaking pencil lead. The response time of the vacuum packaged sensor is also measured.

KW - Acoustic emission sensor

KW - Piezoresistor

KW - Q factor

KW - Silicon resonator

KW - Vacuum package

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Acoustic emission sensors using silicon mechanical resonators

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