Adhesion and nucleation property of CVD-Cu with ALD-Co(W) film as Cu diffusion barrier and adhesion promoting layer in future ULSI interconnects

K. Shima, H. Shimizu, T. Momose, Y. Shimogaki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Biochemistry, Genetics and Molecular Biology

Earth and Planetary Sciences

Material Science

Chemistry