TY - GEN
T1 - Adhesion between Si Substrates in Liquid Water Using Inorganic Polymer
AU - Nemoto, Daiki
AU - Takeuchi, Kai
AU - Higurashi, Eiji
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - In this study, Si/Si pairs were bonded underwater using perhydropolysilazane(PHPS), and the bonding strengths were measured and peeled surfaces were analyzed. As a result, high-strength bonding was obtained while promoting silica conversion of PHPS.
AB - In this study, Si/Si pairs were bonded underwater using perhydropolysilazane(PHPS), and the bonding strengths were measured and peeled surfaces were analyzed. As a result, high-strength bonding was obtained while promoting silica conversion of PHPS.
KW - bonding
KW - perhydropolysilazane
KW - underwater bonding
UR - https://www.scopus.com/pages/publications/85216665953
UR - https://www.scopus.com/pages/publications/85216665953#tab=citedBy
U2 - 10.1109/ICSJ62869.2024.10804705
DO - 10.1109/ICSJ62869.2024.10804705
M3 - Conference contribution
AN - SCOPUS:85216665953
T3 - 13th IEEE CPMT Symposium Japan: Innovation of Packaging Technology for Advanced Heterogeneous Integration, ICSJ 2024
SP - 168
EP - 169
BT - 13th IEEE CPMT Symposium Japan
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th IEEE CPMT Symposium Japan, ICSJ 2024
Y2 - 13 November 2024 through 15 November 2024
ER -