TY - JOUR
T1 - Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI
AU - Makihata, M.
AU - Tanaka, S.
AU - Muroyama, Masanori
AU - Matsuzaki, S.
AU - Yamada, H.
AU - Nakayama, T.
AU - Yamaguchi, U.
AU - Mima, K.
AU - Nonomura, Y.
AU - Fujiyoshi, M.
AU - Esashi, Masayoshi
PY - 2011/8/15
Y1 - 2011/8/15
N2 - This paper describes a wafer bonding process using a 50 νm thick benzocyclobutene (BCB) layer which has vias and metal electrodes. The vias were fabricated by molding BCB using a glass mold. During the molding, worm-like voids grew between BCB and the mold due to the shrinkage of polymerizing BCB. They were completely removed by subsequent reflowing in N2. After patterning Al on the reflowed BCB for the electrodes and via connections, bonding with a glass substrate was performed. Voidless bonding without damage in the vias and electrodes was achieved. Through the process, the control of the polymerization degree of BCB is important, and thus the polymerization degree was evaluated by Fourier transform infrared spectroscopy. The developed process is useful for the wafer-bonding-based integration of different devices, e.g. micro electro mechanical systems and large-scale integrated circuits.
AB - This paper describes a wafer bonding process using a 50 νm thick benzocyclobutene (BCB) layer which has vias and metal electrodes. The vias were fabricated by molding BCB using a glass mold. During the molding, worm-like voids grew between BCB and the mold due to the shrinkage of polymerizing BCB. They were completely removed by subsequent reflowing in N2. After patterning Al on the reflowed BCB for the electrodes and via connections, bonding with a glass substrate was performed. Voidless bonding without damage in the vias and electrodes was achieved. Through the process, the control of the polymerization degree of BCB is important, and thus the polymerization degree was evaluated by Fourier transform infrared spectroscopy. The developed process is useful for the wafer-bonding-based integration of different devices, e.g. micro electro mechanical systems and large-scale integrated circuits.
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U2 - 10.1088/0960-1317/21/8/085002
DO - 10.1088/0960-1317/21/8/085002
M3 - Article
AN - SCOPUS:80051500535
SN - 0960-1317
VL - 21
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
IS - 8
M1 - 085002
ER -