The Global Integration Initiative (GINTI) is 8/12-inch R&D foundry fab for the research and development of new 2.5D/3D integration technologies and creative applications. GINTI offers a broad range of services to meet the mounting R&D needs of the semiconductor industry and related industries. GINTI provides a cost-competitive process development infrastructure in a manufacturing-like fab environment and a low-cost, short TAT prototyping of proof of concepts using commercial/customized 2D chip/wafer, and a base-line process set-up for the pilot production of creative 3D systems. GINTI aims to provide Tohoku University's advanced 2.5D/3D integration technologies into electronic industries to accelerate the commercialization of innovative 3D technologies and applications into real, manufacturing-ready technology solutions with FAST. This paper introduces advanced 2.5D/3D hetero-integration technologies developed by GINTI/Tohoku University.