@inproceedings{05eef75983da4392b2ee5fd5cc6a8ed4,
title = "Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University",
abstract = "The Global Integration Initiative (GINTI) is 8/12-inch R&D foundry fab for the research and development of new 2.5D/3D integration technologies and creative applications. GINTI offers a broad range of services to meet the mounting R&D needs of the semiconductor industry and related industries. GINTI provides a cost-competitive process development infrastructure in a manufacturing-like fab environment and a low-cost, short TAT prototyping of proof of concepts using commercial/customized 2D chip/wafer, and a base-line process set-up for the pilot production of creative 3D systems. GINTI aims to provide Tohoku University's advanced 2.5D/3D integration technologies into electronic industries to accelerate the commercialization of innovative 3D technologies and applications into real, manufacturing-ready technology solutions with FAST. This paper introduces advanced 2.5D/3D hetero-integration technologies developed by GINTI/Tohoku University.",
keywords = "3-D heterogeneous integration, backside TSV, chip self-assembly",
author = "Lee, {K. W.} and Bea, {J. C.} and M. Koyanagi and T. Fukushima and T. Tanaka",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; International 3D Systems Integration Conference, 3DIC 2015 ; Conference date: 31-08-2015 Through 02-09-2015",
year = "2015",
month = nov,
day = "20",
doi = "10.1109/3DIC.2015.7334464",
language = "English",
series = "2015 International 3D Systems Integration Conference, 3DIC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "FS2.1--FS2.5",
booktitle = "2015 International 3D Systems Integration Conference, 3DIC 2015",
address = "United States",
}