Advanced die-to-wafer 3D integration platform: Self-assembly technology

Takafumi Fukushima, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English
Title of host publication	3D Integration for VLSI Systems
Publisher	Pan Stanford Publishing Pte. Ltd.
Pages	153-174
Number of pages	22
ISBN (Print)	9789814303811
DOIs	https://doi.org/10.4032/9789814303828
Publication status	Published - 2011 Sept 30

ASJC Scopus subject areas

@inbook{db077448eece4a3ebe56924782a15f70,

title = "Advanced die-to-wafer 3D integration platform: Self-assembly technology",

author = "Takafumi Fukushima and Lee, {Kang Wook} and Tetsu Tanaka and Mitsumasa Koyanagi",

year = "2011",

month = sep,

day = "30",

doi = "10.4032/9789814303828",

language = "English",

isbn = "9789814303811",

pages = "153--174",

booktitle = "3D Integration for VLSI Systems",

publisher = "Pan Stanford Publishing Pte. Ltd.",

}

TY - CHAP

T1 - Advanced die-to-wafer 3D integration platform

T2 - Self-assembly technology

AU - Fukushima, Takafumi

AU - Lee, Kang Wook

AU - Tanaka, Tetsu

AU - Koyanagi, Mitsumasa

PY - 2011/9/30

Y1 - 2011/9/30

UR - http://www.scopus.com/inward/record.url?scp=84881810762&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84881810762&partnerID=8YFLogxK

U2 - 10.4032/9789814303828

DO - 10.4032/9789814303828

M3 - Chapter

AN - SCOPUS:84881810762

SN - 9789814303811

SP - 153

EP - 174

BT - 3D Integration for VLSI Systems

PB - Pan Stanford Publishing Pte. Ltd.

ER -