TY - GEN
T1 - Advanced FinFET CMOS technology
T2 - 2006 International Electron Devices Meeting, IEDM
AU - Liu, Yongxun
AU - Matsukawa, Takashi
AU - Endo, Kazuhiko
AU - Masahara, Meishoku
AU - Ishii, Kenichi
AU - O'Uchi, Shin Ichi
AU - Yamauchi, Hiromi
AU - Tsukada, Junichi
AU - Ishikawa, Yuki
AU - Suzuki, Eiichi
PY - 2006/12/1
Y1 - 2006/12/1
N2 - We have successfully developed the advanced FinFET fabrication processes for materializing FinFET CMOS circuits. Using the developed technologies, we demonstrate the advanced TiN metal gate, fin-height controlled FinFET CMOS inverter with an excellent transfer performance, and the flexible threshold voltage, asymmetric gate insulator thickness four-terminal (4T) FinFET with a greatly improved subthreshold (S) slope, for the first time.
AB - We have successfully developed the advanced FinFET fabrication processes for materializing FinFET CMOS circuits. Using the developed technologies, we demonstrate the advanced TiN metal gate, fin-height controlled FinFET CMOS inverter with an excellent transfer performance, and the flexible threshold voltage, asymmetric gate insulator thickness four-terminal (4T) FinFET with a greatly improved subthreshold (S) slope, for the first time.
UR - http://www.scopus.com/inward/record.url?scp=46049117875&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=46049117875&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2006.346953
DO - 10.1109/IEDM.2006.346953
M3 - Conference contribution
AN - SCOPUS:46049117875
SN - 1424404398
SN - 9781424404391
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2006 International Electron Devices Meeting Technical Digest, IEDM
Y2 - 10 December 2006 through 13 December 2006
ER -