Advanced sensing with assembled, packaged and embedded technologies

There are the methods to make 3D structures using a manipulator, a metal holder and blocks. Desired 3D structure gives new functions for high sensitive sensing system with magnetic sensors, or strain sensors. The mounted magnet combines the strong magnet property, and the higher quality of Si cantilever sensor without any degradations of magnet and Si resonator during the fabrication processes. The planer function with electro static comb actuators of XY-microstage can be extended to XYZ-microstage by mounting Z-micro stages by assembling. It gives multi-large-strokes for a large cubic scan under cryogenic temperature with low degradation instead of PZT-stages. The randomly deposited NDs on substrate can be embedded by CVD layer. Without any patterning process, the local stress can be applied on the resonator, and the monitoring the stress has been demonstrated using NV centers photoluminescence functions. Assembled 3D structures of MEMS devices will have more possibility to develop new functionalities and challenging researches.