Advanced tape expansion/assembly technology for FOWLP and micro-LED display

T. Fukushima; H. Yonekura; F. Doi; S. Endo; T. Fushimi; K. Yanagimura; M. Koyanagi; T. Tanaka; M. Motoyoshi

doi:10.1109/IMPACT.2018.8625835

Advanced tape expansion/assembly technology for FOWLP and micro-LED display

T. Fukushima, H. Yonekura, F. Doi, S. Endo, T. Fushimi, K. Yanagimura, M. Koyanagi, T. Tanaka, M. Motoyoshi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Abstract

This paper describes advanced assembly technologies based on a new tape expansion technique with a selective UV irradiation method for the application of FOWLP (Fan-Out Wafer-Level Packaging) with millimeter-scale dies and micro-LED display with several tens of micrometer-scaled dielets. The assembly technologies allow us to uniformly expand expansion tapes in all direction and array the dies/dielets at the regular pitches desired for their products. We demonstrate the uniform expansion of an expansion tape with 3-mm-square Si dies and 50-μm-square Si dielets using selectively irradiated UV light through a photomask.

Original language	English
Title of host publication	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Publisher	IEEE Computer Society
Pages	210-213
Number of pages	4
ISBN (Electronic)	9781538656150
DOIs	https://doi.org/10.1109/IMPACT.2018.8625835
Publication status	Published - 2018 Jul 2
Event	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan, Province of China Duration: 2018 Oct 24 → 2018 Oct 26

Publication series

Name	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2018-October
ISSN (Print)	2150-5934
ISSN (Electronic)	2150-5942

Conference

Conference	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Country/Territory	Taiwan, Province of China
City	Taipei
Period	18/10/24 → 18/10/26

Access to Document

10.1109/IMPACT.2018.8625835

Cite this

Fukushima, T., Yonekura, H., Doi, F., Endo, S., Fushimi, T., Yanagimura, K., Koyanagi, M., Tanaka, T., & Motoyoshi, M. (2018). Advanced tape expansion/assembly technology for FOWLP and micro-LED display. In 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 (pp. 210-213). Article 8625835 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2018.8625835

Fukushima, T. ; Yonekura, H. ; Doi, F. et al. / Advanced tape expansion/assembly technology for FOWLP and micro-LED display. 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2018. pp. 210-213 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

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title = "Advanced tape expansion/assembly technology for FOWLP and micro-LED display",

abstract = "This paper describes advanced assembly technologies based on a new tape expansion technique with a selective UV irradiation method for the application of FOWLP (Fan-Out Wafer-Level Packaging) with millimeter-scale dies and micro-LED display with several tens of micrometer-scaled dielets. The assembly technologies allow us to uniformly expand expansion tapes in all direction and array the dies/dielets at the regular pitches desired for their products. We demonstrate the uniform expansion of an expansion tape with 3-mm-square Si dies and 50-μm-square Si dielets using selectively irradiated UV light through a photomask.",

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Fukushima, T, Yonekura, H, Doi, F, Endo, S, Fushimi, T, Yanagimura, K, Koyanagi, M, Tanaka, T & Motoyoshi, M 2018, Advanced tape expansion/assembly technology for FOWLP and micro-LED display. in 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018., 8625835, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, vol. 2018-October, IEEE Computer Society, pp. 210-213, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018, Taipei, Taiwan, Province of China, 18/10/24. https://doi.org/10.1109/IMPACT.2018.8625835

Advanced tape expansion/assembly technology for FOWLP and micro-LED display. / Fukushima, T.; Yonekura, H.; Doi, F. et al.
13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2018. p. 210-213 8625835 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - This paper describes advanced assembly technologies based on a new tape expansion technique with a selective UV irradiation method for the application of FOWLP (Fan-Out Wafer-Level Packaging) with millimeter-scale dies and micro-LED display with several tens of micrometer-scaled dielets. The assembly technologies allow us to uniformly expand expansion tapes in all direction and array the dies/dielets at the regular pitches desired for their products. We demonstrate the uniform expansion of an expansion tape with 3-mm-square Si dies and 50-μm-square Si dielets using selectively irradiated UV light through a photomask.

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Fukushima T, Yonekura H, Doi F, Endo S, Fushimi T, Yanagimura K et al. Advanced tape expansion/assembly technology for FOWLP and micro-LED display. In 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society. 2018. p. 210-213. 8625835. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT.2018.8625835

Advanced tape expansion/assembly technology for FOWLP and micro-LED display

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