This paper reports AlGaN/GaN metal-insulator-semiconductor (MIS)-gate high electron mobility transistors (HEMTs) with a SiCN gate stack deposited by plasma-enhanced chemical vapour deposition (PECVD) using hexamethyldisilazane (HMDS) vapor. A transconductance of 69 mS/mm and a current gain cutoff frequency (fT) of 25 GHz are obtained for the SiCN MIS-HEMTs with a gate length of 0.3 μm. These performances are better than those of the Schottky-gate reference devices. To clarify the origin of these improvements, we verified the cleaning effect of hydrogen used as a carrier gas for HMDS during the PECVD of SiCN. The results indicate that the hydrogen annealing improves the drain current density and fT as well as it suppresses the current collapse.
|Number of pages||4|
|Journal||Physica Status Solidi (C) Current Topics in Solid State Physics|
|Publication status||Published - 2013 May|
- High electron mobility transistor (HEMT)