Abstract
Heavier noble gases Kr and Xe instead of the lighter Ar during the magnetron-sputtering deposition of amorphous indium-gallium-zinc oxide films are introduced in fabricating their thin-film transistors (TFTs). Heavy noble gases can reduce damage to film induced by ion bombardment during the sputtering depositions. Higher field-effect mobility with better gate bias stability can be obtained in the heavier-noble-gas sputtered TFTs. Raman spectroscopic analysis and X-ray reflectometry respectively suggest that the disordered structure in the film is suppressed, and the film becomes denser by introducing heavy noble gases, corresponding to the improvement of TFT performance.
Original language | English |
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Pages (from-to) | 517-523 |
Number of pages | 7 |
Journal | Journal of the Society for Information Display |
Volume | 21 |
Issue number | 12 |
DOIs | |
Publication status | Published - 2013 Dec |
Keywords
- damage
- IGZO
- krypton
- magnetron sputtering
- TFT
- xenon