TY - JOUR
T1 - An analysis of the kink phenomena in InAlAs/InGaAs HEMT's using two-dimensional device simulation
AU - Suemitsu, T.
AU - Enoki, T.
AU - Tomizawa, M.
AU - Ishii, Y.
AU - Sano, N.
PY - 1998
Y1 - 1998
N2 - Kink phenomena in InAlAs/InGaAs HEMT's are investigated using a two-dimensional (2-D) device simulation that takes into account impact ionization, including nonlocal field effects, and the surface states in a side-etched region at the gate periphery. The simulation model enables us to represent the kink, and it is found that the accumulation of holes generated by the impact ionization has the channel electron density in the side-etched region increase at the bias point where kink appears. When the electron density in the side-etched region is small, the hole accumulation causes a significant increase in that electron density, resulting in a large kink. The simulation results suggest a model in which the kink is described in terms of the modification of the parasitic source resistance induced by the hole accumulation. This model implies a way to eliminate the kink, that is, keeping the electron density in the side-etched region high.
AB - Kink phenomena in InAlAs/InGaAs HEMT's are investigated using a two-dimensional (2-D) device simulation that takes into account impact ionization, including nonlocal field effects, and the surface states in a side-etched region at the gate periphery. The simulation model enables us to represent the kink, and it is found that the accumulation of holes generated by the impact ionization has the channel electron density in the side-etched region increase at the bias point where kink appears. When the electron density in the side-etched region is small, the hole accumulation causes a significant increase in that electron density, resulting in a large kink. The simulation results suggest a model in which the kink is described in terms of the modification of the parasitic source resistance induced by the hole accumulation. This model implies a way to eliminate the kink, that is, keeping the electron density in the side-etched region high.
KW - Fet's, indium materials/devices
KW - MODFET's, semiconductor device modeling
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U2 - 10.1109/16.735714
DO - 10.1109/16.735714
M3 - Article
AN - SCOPUS:0032307757
SN - 0018-9383
VL - 45
SP - 2390
EP - 2399
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 12
ER -