TY - GEN
T1 - An Efficient Reference Image Sharing Method for the Parallel Video Encoding Architecture
AU - Nakamura, Ken
AU - Omori, Yuya
AU - Kobayashi, Daisuke
AU - Nitta, Koyo
AU - Sano, Kimikazu
AU - Sato, Masayuki
AU - Iwasaki, Hiroe
AU - Kobayashi, Hiroaki
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Video coding hardware is essential for various video applications, and to meet demands for higher resolution, the parallel video encoding architecture is often adopted, in which reference images are shared among encoder modules to maintain coding efficiency. However, conventional sharing methods are not always efficient in utilization of transferred image data. In this paper, we propose a method to reduce the amount of data transfer efficiently by using both pre-transfer and on-demand transfer. Experimental results show that the data transfer can be reduced to 19.8-35.3% of the conventional method on average although the access error rate increases to 0.5-2%. This makes it possible to reduce the required bandwidth of the inter-chip interface by saving the amount of data transfer.
AB - Video coding hardware is essential for various video applications, and to meet demands for higher resolution, the parallel video encoding architecture is often adopted, in which reference images are shared among encoder modules to maintain coding efficiency. However, conventional sharing methods are not always efficient in utilization of transferred image data. In this paper, we propose a method to reduce the amount of data transfer efficiently by using both pre-transfer and on-demand transfer. Experimental results show that the data transfer can be reduced to 19.8-35.3% of the conventional method on average although the access error rate increases to 0.5-2%. This makes it possible to reduce the required bandwidth of the inter-chip interface by saving the amount of data transfer.
KW - cache memory
KW - gem5
KW - HEVC
KW - multi-chip
KW - video coding
UR - http://www.scopus.com/inward/record.url?scp=85130846366&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85130846366&partnerID=8YFLogxK
U2 - 10.1109/COOLCHIPS54332.2022.9772670
DO - 10.1109/COOLCHIPS54332.2022.9772670
M3 - Conference contribution
AN - SCOPUS:85130846366
T3 - 25th IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2022 - Proceedings
BT - 25th IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2022 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2022
Y2 - 20 April 2022 through 22 April 2022
ER -