Abstract
Randomly oriented polycrystalline silicon (poly-Si) thin films with a typical grain size of 20 × 2 μm2 grown by continuous-wave laser lateral crystallization (CLC) were obtained. It was found that CLC poly-Si thin films have a large tensile strain corresponding to 0.6% of single-crystalline Si lattice in the in-plane direction. These results suggest that there is a possibility that not only grain size but also the large tensile strain in in-plane direction can affect thin film transistor (TFT) performance.
Original language | English |
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Pages (from-to) | 3046-3049 |
Number of pages | 4 |
Journal | Japanese Journal of Applied Physics |
Volume | 47 |
Issue number | 4 PART 2 |
DOIs | |
Publication status | Published - 2008 Apr 25 |
Keywords
- CLC
- Crystallization
- CW laser
- Grain
- Poly-Si
- Strain