Abstract
A parameter dominating electromigration damage, AFD, has been recently proposed. On the other hand, it has been shown that the Thomson effect which is a kind of thermoelectric effect is not negligible for the temperature distribution in the metal line which is subjected to high current density. The effect of the temperature distribution considering the Thomson effect on the void formation induced by electromigration has not been investigated so far. In this study, the temperature distribution in an angled metal line was analyzed considering the Thomson effect, and the void formation near the corner was predicted by obtaining the value of AFD based on the temperature analysis in order to extract the effect of the Thomson effect on the void formation. The Cu line, which was expected as a next line material in near future, was treated in comparison with the Al line.
| Original language | English |
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| Pages | 87-92 |
| Number of pages | 6 |
| Publication status | Published - 1998 |
| Event | Proceedings of the 1998 ASME International Mechanical Engineering Congress and Exposition - Anaheim, CA, USA Duration: 1998 Nov 15 → 1998 Nov 20 |
Other
| Other | Proceedings of the 1998 ASME International Mechanical Engineering Congress and Exposition |
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| City | Anaheim, CA, USA |
| Period | 98/11/15 → 98/11/20 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering