Angled exposure method for pattering on three-dimensional structures

Vijay Kumar Singh, Minoru Sasaki, Kazuhiro Hane

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)


Photolithography on three-dimensional structures is becoming a key process for realizing new micromechanical devices. Patterning on three-dimensional structures using the conventional mask aligner is a difficult task. In this paper, we present an approach for transferring patterns on cavities prepared by anisotropic etching. A new method of angled exposing is introduced for improving the uniformity of the incident-light-power density transmitted into the resist film deposited on the cavities. This method also reduces the number of reflections coming from the sidewalls of the cavities. Polarized light is used for realizing a pattern on the narrow cavities with a high aspect ratio.

Original languageEnglish
Pages (from-to)6449-6453
Number of pages5
JournalJapanese Journal of Applied Physics
Issue number9 B
Publication statusPublished - 2007 Sept 20


  • Angled exposure
  • Polarized light
  • Reflection
  • Spray coating
  • Three-dimensional photolithography


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