TY - GEN
T1 - Anisotropic strain-field-induced change of the electronic conductivity of graphene sheets and carbon nanotubes
AU - Ohnishi, Masato
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2012/5/28
Y1 - 2012/5/28
N2 - Both a molecular dynamics analysis and the first principle calculation were applied to the explication of the relationship between the three-dimensional deformation of a CNT and a graphene sheet and their electronic conductivity,. In this study, various combinations of double-walled carbon nanotube structures were modeled for the analyses. The change of the resistivity of multi-walled carbon nanotubes (MWCNTs) under uni-axial strain was analyzed by applying the abinitio calculation based on density functional theory. Since a CNT consists of a six-membered carbon ring, the change of the band structure of a graphene sheet was also analyzed by applying the abinitio calculation based on density functional theory.
AB - Both a molecular dynamics analysis and the first principle calculation were applied to the explication of the relationship between the three-dimensional deformation of a CNT and a graphene sheet and their electronic conductivity,. In this study, various combinations of double-walled carbon nanotube structures were modeled for the analyses. The change of the resistivity of multi-walled carbon nanotubes (MWCNTs) under uni-axial strain was analyzed by applying the abinitio calculation based on density functional theory. Since a CNT consists of a six-membered carbon ring, the change of the band structure of a graphene sheet was also analyzed by applying the abinitio calculation based on density functional theory.
UR - http://www.scopus.com/inward/record.url?scp=84861363008&partnerID=8YFLogxK
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U2 - 10.1109/ESimE.2012.6191706
DO - 10.1109/ESimE.2012.6191706
M3 - Conference contribution
AN - SCOPUS:84861363008
SN - 9781467315128
T3 - 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
BT - 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
T2 - 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Y2 - 16 April 2012 through 18 April 2012
ER -