TY - JOUR
T1 - Application of Accelerated Quantum Chemical Molecular Dynamics Method to the Electric and Electronics Engineering
AU - Yokosuka, Toshiyuki
AU - Sasata, Katsumi
AU - Endou, Akira
AU - Kubo, Momoji
AU - Miyamoto, Akira
PY - 2003
Y1 - 2003
N2 - In addition to the theoretical prediction on the properties and functions of the electric and electronics materials, the simulation on the dynamic processes, such as etching process and chemical mechanical polishing process, are strongly demanded. Recently, we have succeeded in the development of a new accelerated quantum chemical molecular dynamics program, which is more than 5,000 times faster than the regular first-principles molecular dynamics approach. This program enables us to calculate a realistic etching process, chemical mechanical polishing process, etc., employing large simulation model. In this review, we summarize the theory of our accelerated quantum chemical molecular dynamics and its application to various dynamic processes related to the electric and electronics engineering.
AB - In addition to the theoretical prediction on the properties and functions of the electric and electronics materials, the simulation on the dynamic processes, such as etching process and chemical mechanical polishing process, are strongly demanded. Recently, we have succeeded in the development of a new accelerated quantum chemical molecular dynamics program, which is more than 5,000 times faster than the regular first-principles molecular dynamics approach. This program enables us to calculate a realistic etching process, chemical mechanical polishing process, etc., employing large simulation model. In this review, we summarize the theory of our accelerated quantum chemical molecular dynamics and its application to various dynamic processes related to the electric and electronics engineering.
KW - accelerated quantum chemical molecular dynamics method
KW - computational science
KW - Tight-Binding approximation
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U2 - 10.1541/ieejfms.123.114
DO - 10.1541/ieejfms.123.114
M3 - Article
AN - SCOPUS:85024460839
SN - 0385-4205
VL - 123
SP - 114
EP - 117
JO - IEEJ Transactions on Fundamentals and Materials
JF - IEEJ Transactions on Fundamentals and Materials
IS - 2
ER -