Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

J. Frömel; D. Billep; T. Geßner; M. Wiemer

doi:10.1007/s00542-005-0032-8

Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

J. Frömel, D. Billep, T. Geßner, M. Wiemer

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

This paper describes the application of a new method to verify the pressure and sealing of cavities in micromechanical components. The new method makes it possible to measure the pressure and the sealing (through measuring the pressure over time) of smallest gasvolumes with the monitoring of the quality factor of integrated micromechanical resonant structures. An example is used that shows the complete process of fabricating such micro mechanical resonant structures to evaluate a bonded structure.

Original language	English
Pages (from-to)	481-483
Number of pages	3
Journal	Microsystem Technologies
Volume	12
Issue number	5
DOIs	https://doi.org/10.1007/s00542-005-0032-8
Publication status	Published - 2006 Apr

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Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

Abstract

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