TY - GEN
T1 - Assembled comb-drive XYZ-microstage with large displacements for low temperature measurement systems
AU - Xue, Gaopeng
AU - Toda, Masaya
AU - Ono, Takahito
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/2/26
Y1 - 2015/2/26
N2 - In this research, we report the novel design, fabrication and testing of an assembled comb-drive XYZ-microstage that produces highly decoupled motions into X-, Y-, and Z-directions for the three-dimensional (3D) scanning stage of magnetic resonance force microscopy. The XYZ-microstage based on assembling technology consists of three separated parts, i.e., a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate. The separated parts are assembled together by using micro manipulators and a guide block of stainless steel. It is demonstrated that the assembled XYZ-microstage can achieve large displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction.
AB - In this research, we report the novel design, fabrication and testing of an assembled comb-drive XYZ-microstage that produces highly decoupled motions into X-, Y-, and Z-directions for the three-dimensional (3D) scanning stage of magnetic resonance force microscopy. The XYZ-microstage based on assembling technology consists of three separated parts, i.e., a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate. The separated parts are assembled together by using micro manipulators and a guide block of stainless steel. It is demonstrated that the assembled XYZ-microstage can achieve large displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction.
UR - http://www.scopus.com/inward/record.url?scp=84931084300&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84931084300&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2015.7050874
DO - 10.1109/MEMSYS.2015.7050874
M3 - Conference contribution
AN - SCOPUS:84931084300
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 14
EP - 17
BT - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
Y2 - 18 January 2015 through 22 January 2015
ER -