Athermal Silicon photonic devices using hybrid polymer cladding

Tomohiro Kita; Freddy Susanto Tan; Okihiro Sugihara; Hirohito Yamada; Toshikuni Kaino

Athermal Silicon photonic devices using hybrid polymer cladding

Tomohiro Kita, Freddy Susanto Tan, Okihiro Sugihara, Hirohito Yamada, Toshikuni Kaino

ENG - Communications Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO₂ nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

Original language	English
Pages	272-275
Number of pages	4
Publication status	Published - 2014
Event	23rd International Conference on Plastic Optical Fibers, POF 2014 - Hiyoshi, Yokohama, Japan Duration: 2014 Oct 8 → 2014 Oct 10

Conference

Conference	23rd International Conference on Plastic Optical Fibers, POF 2014
Country/Territory	Japan
City	Hiyoshi, Yokohama
Period	14/10/8 → 14/10/10

Keywords

Hybrid polymer
Silicon photonics
Thermo-optic effect
TiO nanoparticles

Cite this

@conference{56ad171dd4e14f7f8899b262c75fda35,

title = "Athermal Silicon photonic devices using hybrid polymer cladding",

abstract = "The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.",

keywords = "Hybrid polymer, Silicon photonics, Thermo-optic effect, TiO nanoparticles",

author = "Tomohiro Kita and Tan, {Freddy Susanto} and Okihiro Sugihara and Hirohito Yamada and Toshikuni Kaino",

note = "Publisher Copyright: {\textcopyright} 2014 ICPOF.; 23rd International Conference on Plastic Optical Fibers, POF 2014 ; Conference date: 08-10-2014 Through 10-10-2014",

year = "2014",

language = "English",

pages = "272--275",

}

TY - CONF

T1 - Athermal Silicon photonic devices using hybrid polymer cladding

AU - Kita, Tomohiro

AU - Tan, Freddy Susanto

AU - Sugihara, Okihiro

AU - Yamada, Hirohito

AU - Kaino, Toshikuni

PY - 2014

Y1 - 2014

N2 - The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

AB - The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

KW - Hybrid polymer

KW - Silicon photonics

KW - Thermo-optic effect

KW - TiO nanoparticles

UR - http://www.scopus.com/inward/record.url?scp=84924982594&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84924982594&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84924982594

SP - 272

EP - 275

T2 - 23rd International Conference on Plastic Optical Fibers, POF 2014

Y2 - 8 October 2014 through 10 October 2014

ER -

Athermal Silicon photonic devices using hybrid polymer cladding

Abstract

Conference

Keywords

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