Atomic diffusion bonding in air using Ag films

Yuki Watabe; Fuki Goto; Miyuki Uomoto; Takehito Shimatsu

doi:10.35848/1347-4065/ac5760

Atomic diffusion bonding in air using Ag films

Yuki Watabe, Fuki Goto, Miyuki Uomoto, Takehito Shimatsu

Research output: Contribution to journal › Article › peer-review

Abstract

Atomic diffusion bonding (ADB) of wafers at room temperature in air was studied using Ag films. Using an ultra-high vacuum magnetron sputtering system, Ag (20 nm) films with Ti (5 nm) underlayers were deposited. The propagation speed of crystal lattice rearrangement in the bonding process decreased with an increased exposure time of film surfaces to air (t exp). Propagation did not occur at t exp of 500 s. The cohesion of Ag film surfaces by film surface exposure to air and reduction of the Ag film surface energy by Ag oxide or sulfide formation probably cause ADB performance degradation.

Original language	English
Article number	SF1003
Journal	Japanese journal of applied physics
Volume	61
Issue number	SE
DOIs	https://doi.org/10.35848/1347-4065/ac5760
Publication status	Published - 2022 Jun

Keywords

adhesion
atomic diffusion bonding in air
cohesion
crystal lattice rearrangement
room temperature bonding
silver films
surface energy

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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10.35848/1347-4065/ac5760

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title = "Atomic diffusion bonding in air using Ag films",

abstract = "Atomic diffusion bonding (ADB) of wafers at room temperature in air was studied using Ag films. Using an ultra-high vacuum magnetron sputtering system, Ag (20 nm) films with Ti (5 nm) underlayers were deposited. The propagation speed of crystal lattice rearrangement in the bonding process decreased with an increased exposure time of film surfaces to air (t exp). Propagation did not occur at t exp of 500 s. The cohesion of Ag film surfaces by film surface exposure to air and reduction of the Ag film surface energy by Ag oxide or sulfide formation probably cause ADB performance degradation.",

keywords = "adhesion, atomic diffusion bonding in air, cohesion, crystal lattice rearrangement, room temperature bonding, silver films, surface energy",

author = "Yuki Watabe and Fuki Goto and Miyuki Uomoto and Takehito Shimatsu",

note = "Funding Information: This work was supported by the Council for Science, Technology and innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), “Energy systems toward a decarbonized society” (Funding agency: JST). Publisher Copyright: {\textcopyright} 2022 The Japan Society of Applied Physics.",

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language = "English",

volume = "61",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

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AU - Watabe, Yuki

AU - Goto, Fuki

AU - Uomoto, Miyuki

AU - Shimatsu, Takehito

N1 - Funding Information: This work was supported by the Council for Science, Technology and innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), “Energy systems toward a decarbonized society” (Funding agency: JST). Publisher Copyright: © 2022 The Japan Society of Applied Physics.

PY - 2022/6

Y1 - 2022/6

N2 - Atomic diffusion bonding (ADB) of wafers at room temperature in air was studied using Ag films. Using an ultra-high vacuum magnetron sputtering system, Ag (20 nm) films with Ti (5 nm) underlayers were deposited. The propagation speed of crystal lattice rearrangement in the bonding process decreased with an increased exposure time of film surfaces to air (t exp). Propagation did not occur at t exp of 500 s. The cohesion of Ag film surfaces by film surface exposure to air and reduction of the Ag film surface energy by Ag oxide or sulfide formation probably cause ADB performance degradation.

AB - Atomic diffusion bonding (ADB) of wafers at room temperature in air was studied using Ag films. Using an ultra-high vacuum magnetron sputtering system, Ag (20 nm) films with Ti (5 nm) underlayers were deposited. The propagation speed of crystal lattice rearrangement in the bonding process decreased with an increased exposure time of film surfaces to air (t exp). Propagation did not occur at t exp of 500 s. The cohesion of Ag film surfaces by film surface exposure to air and reduction of the Ag film surface energy by Ag oxide or sulfide formation probably cause ADB performance degradation.

KW - adhesion

KW - atomic diffusion bonding in air

KW - cohesion

KW - crystal lattice rearrangement

KW - room temperature bonding

KW - silver films

KW - surface energy

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JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

IS - SE

M1 - SF1003

ER -

Atomic diffusion bonding in air using Ag films

Abstract

Keywords

ASJC Scopus subject areas

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