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Atomic diffusion bonding of wafers with thin nanocrystalline metal films
Takehito Shimatsu
, M. Uomoto
Advanced Interdisciplinary Research Division
Research output
:
Contribution to journal
›
Article
›
peer-review
105
Citations (Scopus)
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Dive into the research topics of 'Atomic diffusion bonding of wafers with thin nanocrystalline metal films'. Together they form a unique fingerprint.
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Chemistry
Liquid Film
100%
Self-Diffusion Coefficient
22%
Atomic Diffusion
22%
Nanocrystalline Metal
22%
Ambient Reaction Temperature
22%
Electron Particle
11%
Diffusion Coefficient
11%
Face-Centered Cubic Crystal System
11%
Crystal Structure
11%
Amorphous Material
11%
Metal
11%
Nanocrystallinity
11%
Device
11%
Procedure
11%
Vacuum
11%
Surface
11%
Crystalline Material
11%
Sputter Deposition
11%
Recrystallization
11%
Grain Boundary
11%
Engineering
Room Temperature
22%
Film Surface
22%
Nanocrystalline Metal
22%
Atomic Diffusion
22%
Original Surface
22%
Thin Films
11%
Experimental Result
11%
Grain Boundary
11%
Diffusion Coefficient
11%
Bonded Structure
11%
Cu Film
11%
Boundary Surface
11%
Crystal Structure
11%
Face-Centered Cubic
11%
Diffusion Bonding
11%
Wafer Bonding
11%
Microscopic Cross Section
11%
Bonded Interface
11%
Transmissions
11%
Surfaces
11%
Images
11%
Recrystallization
11%
Physics
Wafer
77%
Metal Films
66%
Room Temperature
22%
Thin Films
11%
Crystal Structure
11%
Diffusivity
11%
Microelectromechanical System
11%
Thick Films
11%
Area
11%
Vacuum
11%
Images
11%
Metal
11%
Sides
11%
Grain Boundaries
11%
Recrystallization
11%
Material Science
Liquid Films
100%
Thin Films
11%
Film Deposition
11%
Thick Films
11%
Surface
11%
Material
11%
Crystalline Material
11%
Crystal Structure
11%
Amorphous Material
11%
Grain Boundary
11%