Atomizing effect on Sn-Zn based solder alloy

Masahiko Yamaguchi, Tetsu Ichitsubo, Eiichiro Matsubara, Hisamichi Kimura, Kenichiro Sasamori, Hisao Irie, Seishi Kumamoto, Takaaki Anada

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


Sn-Zn based solder alloys are expected to be a potential candidate as a lead-free low temperature solder because of its melting point close to that of Sn-Pb. There are, however, several problems in practical application. Cu-Zn intermetallic compound (IMC) layer formed at the solder and Cu substrate interface leads to degradation of adhesion strength. In order to prevent the formation of Cu-Zn IMC, we have added some additives (Ni and Cu) to the Sn-Zn solders. We have also investigated the quenching effect by the atomization process in these Sn-Zn-(Ni and Cu) solders. For the pre-atomized solders, Cu-Zn IMC layer is formed at the interface. On the other hand, for the atomized solders, Cu-Sn IMC layer which is usually seen in Sn-Pb solder is observed instead.

Original languageEnglish
Pages (from-to)162-165
Number of pages4
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Issue number2
Publication statusPublished - 2006 Feb


  • Atomization
  • Intermetallic compound
  • Lead-free solder
  • Solder paste
  • Tin-zinc


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