TY - JOUR
T1 - Atomizing effect on Sn-Zn based solder alloy
AU - Yamaguchi, Masahiko
AU - Ichitsubo, Tetsu
AU - Matsubara, Eiichiro
AU - Kimura, Hisamichi
AU - Sasamori, Kenichiro
AU - Irie, Hisao
AU - Kumamoto, Seishi
AU - Anada, Takaaki
PY - 2006/2
Y1 - 2006/2
N2 - Sn-Zn based solder alloys are expected to be a potential candidate as a lead-free low temperature solder because of its melting point close to that of Sn-Pb. There are, however, several problems in practical application. Cu-Zn intermetallic compound (IMC) layer formed at the solder and Cu substrate interface leads to degradation of adhesion strength. In order to prevent the formation of Cu-Zn IMC, we have added some additives (Ni and Cu) to the Sn-Zn solders. We have also investigated the quenching effect by the atomization process in these Sn-Zn-(Ni and Cu) solders. For the pre-atomized solders, Cu-Zn IMC layer is formed at the interface. On the other hand, for the atomized solders, Cu-Sn IMC layer which is usually seen in Sn-Pb solder is observed instead.
AB - Sn-Zn based solder alloys are expected to be a potential candidate as a lead-free low temperature solder because of its melting point close to that of Sn-Pb. There are, however, several problems in practical application. Cu-Zn intermetallic compound (IMC) layer formed at the solder and Cu substrate interface leads to degradation of adhesion strength. In order to prevent the formation of Cu-Zn IMC, we have added some additives (Ni and Cu) to the Sn-Zn solders. We have also investigated the quenching effect by the atomization process in these Sn-Zn-(Ni and Cu) solders. For the pre-atomized solders, Cu-Zn IMC layer is formed at the interface. On the other hand, for the atomized solders, Cu-Sn IMC layer which is usually seen in Sn-Pb solder is observed instead.
KW - Atomization
KW - Intermetallic compound
KW - Lead-free solder
KW - Solder paste
KW - Tin-zinc
UR - http://www.scopus.com/inward/record.url?scp=33645760382&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33645760382&partnerID=8YFLogxK
U2 - 10.2320/jinstmet.70.162
DO - 10.2320/jinstmet.70.162
M3 - Article
AN - SCOPUS:33645760382
SN - 0021-4876
VL - 70
SP - 162
EP - 165
JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
IS - 2
ER -