Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors

Yuki Honda, Kei Hagiwara, Masahide Goto, Toshihisa Watabe, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Eiji Higurashi, Toshiro Hiramoto

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Citations (Scopus)

Abstract

A 3D structured CMOS image sensor that can process signals pixel-wise in parallel is investigated as a means to simultaneously increase the pixel count and the frame rate. To make the pixel pitch finer, the Au electrode dimension is reduced to a 6-μm pitch that is electrically interconnected using a direct-bonding technique. We also develop a daisy-chain test device to examine the numerous interconnections. The experimental results show that the series of electrical interconnections exceeds 230,000 contacts, with the Au contact resistance for a single connection being ∼23.6 mω.

Original languageEnglish
Title of host publicationSemiconductor Wafer Bonding
Subtitle of host publicationScience, Technology and Applications 14
EditorsT. Suga, H. Baumgart, F. Fournel, M. S. Goorsky, K. D. Hobart, R. Knechtel, C. S. Tan
PublisherElectrochemical Society Inc.
Pages103-106
Number of pages4
Edition9
ISBN (Electronic)9781607687269, 9781607687672, 9781607687689, 9781607687696, 9781607687702, 9781607687719, 9781607687726, 9781607687733, 9781607687740, 9781607687757, 9781607687771, 9781607687788, 9781607687795, 9781607687801, 9781607687818, 9781607687825, 9781607687832, 9781607687849, 9781607687856, 9781607687863, 9781607687887, 9781607687894, 9781607687900, 9781607687917, 9781607687924, 9781607687931, 9781607687948, 9781607687955, 9781607687962, 9781607687979, 9781607687986, 9781607687993, 9781607688006, 9781607688013, 9781607688020, 9781607688037
DOIs
Publication statusPublished - 2016
EventSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting - Honolulu, United States
Duration: 2016 Oct 22016 Oct 7

Publication series

NameECS Transactions
Number9
Volume75
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

ConferenceSymposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting
Country/TerritoryUnited States
CityHonolulu
Period16/10/216/10/7

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