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Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors
Yuki Honda, Kei Hagiwara, Masahide Goto, Toshihisa Watabe, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Eiji Higurashi, Toshiro Hiramoto
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution